JPS6237929U - - Google Patents

Info

Publication number
JPS6237929U
JPS6237929U JP12843485U JP12843485U JPS6237929U JP S6237929 U JPS6237929 U JP S6237929U JP 12843485 U JP12843485 U JP 12843485U JP 12843485 U JP12843485 U JP 12843485U JP S6237929 U JPS6237929 U JP S6237929U
Authority
JP
Japan
Prior art keywords
clamp
spring plate
movable spring
clamping force
movable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12843485U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0236279Y2 (en]
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12843485U priority Critical patent/JPH0236279Y2/ja
Publication of JPS6237929U publication Critical patent/JPS6237929U/ja
Application granted granted Critical
Publication of JPH0236279Y2 publication Critical patent/JPH0236279Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus

Landscapes

  • Wire Bonding (AREA)
JP12843485U 1985-08-23 1985-08-23 Expired JPH0236279Y2 (en])

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12843485U JPH0236279Y2 (en]) 1985-08-23 1985-08-23

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12843485U JPH0236279Y2 (en]) 1985-08-23 1985-08-23

Publications (2)

Publication Number Publication Date
JPS6237929U true JPS6237929U (en]) 1987-03-06
JPH0236279Y2 JPH0236279Y2 (en]) 1990-10-03

Family

ID=31024099

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12843485U Expired JPH0236279Y2 (en]) 1985-08-23 1985-08-23

Country Status (1)

Country Link
JP (1) JPH0236279Y2 (en])

Also Published As

Publication number Publication date
JPH0236279Y2 (en]) 1990-10-03

Similar Documents

Publication Publication Date Title
JPS6237929U (en])
JPS58190977U (ja) ミシンの布切断装置
JPH0325591U (en])
JPS58154035U (ja) 工具交換用ア−ム
JPS60113190U (ja) 薄板溶接機のクランプ
JPS6431592U (en])
JPS6090151U (ja) 開閉装置
JPS58150489U (ja) 工業用ロボツトの把持装置
JPS59167675U (ja) 自動釘打機の釘打込深さ調整装置
JPS6085620U (ja) コントロ−ルケ−ブルの遊嵌部品の遊動規制装置
JPS59115074U (ja) 蓋の開閉機構
JPS60112U (ja) シ−トモ−ルデイングコンパウンド材料保持装置
JPS59105325U (ja) ネジ締付装置
JPS5934978U (ja) 線材交叉部の締付機
JPS5871500U (ja) 搗き固め機
JPS60113807U (ja) 圧入チヤツク装置
JPS6084187U (ja) 板物ワ−ク供給装置
JPS6261423U (en])
JPS59154836U (ja) 農作業機のアクセル操作装置
JPS59169444U (ja) 開閉機構のダンパ装置
JPS5969061U (ja) 遮断機の遮断桿位置調整装置
JPS63193U (en])
JPH0352160U (en])
JPH02149189U (en])
JPS60163342U (ja) シフトレバ−把持装置